Corsair TWIN3X2048-1800C7DFIN 2GB (2x XMS3 1GB) PC-14400 (1800MHz) XMP DDR3 RAM,

DOMINATOR™ - Extreme Performance, Overclockable Memory
The DOMINATOR family of memory represents the ultimate in performance technology engineering from Corsair. The DOMINATOR was designed to have the highest performing IC maximum over-clocking capability and efficient DHX cooling – all the while being stable and reliable.
DDR3 Modules
Part Number Speed Size Latency Package
TWIN3X2048-1800C7DF G PC3-14400 2GB Kit 7-7-7-20 240pin DIMM
TWIN3X2048-1800C7DFIN G * PC3-14400 2GB Kit 7-7-7-20 240pin DIMM
* Supports Intel Extreme Memory Profiles
DDR2 Modules
Part Number Speed Size Latency Package
TWIN2X2048-10000C5DF PC2-10000 2GB Kit 5-5-5-18 240pin DIMM
TWIN2X2048-9136C5D PC2-9136 2GB Kit 5-5-5-15 240pin DIMM
TWIN2X2048-8888C4DF PC2-8888 2GB Kit 4-4-4-12 240pin DIMM
TWIN2X2048-8500C5D PC2-8500 2GB Kit 5-5-5-15 240pin DIMM
TWIN2X2048-8500C5DF PC2-8500 2GB Kit 5-5-5-15 240pin DIMM
QUAD2X4096-8500C5DF PC2-8500 4GB Kit 5-5-5-15 240pin DIMM
TWIN2X2048-6400C3DF PC2-6400 2GB Kit 3-4-3-9 240pin DIMM
DOMINATOR - Best of Corsair’s Engineering
Very few components make it into the DOMINATOR family. Corsair performs rigorous testing and screening on all components to select only the best for the DOMINATOR modules. The tests check for high frequency and/or low latency capabilities for each IC. Then, they are thoroughly tested for maximum interoperability and reliability as a united group to meet the stringent design criteria demanded by performance computing and gaming users.
Superior Heat Dissipation
Heat is the enemy of your computer’s key components. And the more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR2 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50% of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there’s no easy thermal path for the heat coming from the back of the chips.
Corsair’s Unique Dual-path Heat Xchange (DHX) Solves the Problem
Corsair’s engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board - Convection and Conduction.
Optional AirFlow - Extra Cooling for Extreme Overclocking
The optional Airflow fan unit contains three 40mm tachometer-controlled fans to provide impinging airflow to the memory subsystem. With the moderate RPMs required to provide adequate forced air, the Airflow fan is nearly silent. The fan easily clamps onto most motherboards.
Overclocking Now Made Easier with Enhanced Performance Profiles (EPP)
Corsair and NVIDIA have jointly developed a new open standard that enhances the Serial Presence Detect (SPD). This exciting new development simplifies the overclocking process while ensuring platform and component compatibility. EPP compatible motherboards can access and take advantage of added performance capabilities and information. The result: simplified overclocking and unparalleled control for experts.
DOMINATOR - Setting the New Standard
DOMINATOR is the industry’s performance and award leader. It has won numerous honors to date including various Editor’s Choice awards and several “Memory of the Year” honors.