Gigabyte X299 Aorus Master Lga2066 12 Phases Digital Vrm 8Xddr4 4Xpcie3.0 3Xm.2 Raid Intel Gbe

SKU
272048
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QUICK OVERVIEW

LAN 8xthSATA USB3.1 Type-C Thunderbolt CF/ SLI 2xwaRGB X299 AORUS MASTER
AORUS PERFORMANCE
12-Phase Digital Power Design

The X299 AORUS MASTER motherboard uses a 12-phase digital CPU power design which includes two digital PWM Controller. The 100% high-quality digital controller and additional 8+8 solid-pin CPU power connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new 9th generation Intel Core processors.

X299
2X Copper PCB

GIGABYTE's exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that's necessary when overclocking.

X299
Fins-Array Heatsink with 6mm Heatpipe and High Thermal Conductivity Pad

X299 AORUS MASTER uses a Fins-Array heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. By using a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pad, it can transfer 2.7x more heat than traditional thermal pads in the same time period. The 6mm heatpipe helps to transfer heat between two heatsinks which improves the overall thermal balance of the MOSFETs.

X299
  1. Fins-Array
    300% increase of the heat dissipation area compared to traditional heatsinks of the same size.
  2. Active Fan
    Built-in active cooling fan for faster MOSFET heat dissipation while automatically adjusting fan speed based on VRM temps.
  3. 6mm Heatpipe
    The heatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs.
  4. High Thermal Conductivity Pad
    By using a 1.5mm thicker 5W/mK thermal conductivity pad, 2.7x more heat is transferred compared to standard thermal pads.
  5. Thermal Baseplate
    By using thermal pads between the PCB back-side components and baseplate, heat is transferred and dissipates safely by the large metal plate.
Base Plate + I/O Shield Armor
Durable Design and Easy Installation
X299
  • With an integrated base plate, GIGABYTE motherboards give users a strong foundation to build their gaming PCs.
  • With an integrated I/O shield, building a GIGABYTE ultra-durable PC is now even easier.
  • Integrated Power/Reset/Clear CMOS buttons on the I/O shield enable users with easier debugging and operation.
X299
4-Way Dual Wide PCIe-Lane Design
  • 3- and 4-Way graphics provide up to 40 PCIe lanes of bandwidth.
  • X299 AORUS MASTER features a unique PCI Express design that utilizes all 44 lanes from the CPU for full bandwidth.
  • The placement allows users to install 4 dual wide PCIe cards at the same time.
X299
X299
Triple PCIe Gen3 x4 M.2

AORUS gaming motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system's potential.

X299
X299
Triple NVMe M.2 PCIe SSDs in RAID 0 Support

Extreme Performance with Gen3 x4 NVMe PCIe SSDs

X299 AORUS motherboards offer the industry's best compatibility in terms of NVMe storage for users who demand high capacity and seek the best performance. AORUS' unique design can be configured in RAID for record speeds up to 3551 MBps (Sequential Read), making AORUS the obvious choice for the ultimate PC build.

X299
AORUS M.2 Thermal Guard
GIGABYTE Ultra-Efficient M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Thermal Throttling as Temperature Rises
X299
X299
Support for DDR4 XMP Up to 4000MHz and Beyond

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 4000MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

X299
Broad DDR4 Compatibility with a Support List of 1000+

AORUS works very closely with memory vendors from around the world to ensure that virtually all modules offered by popular memory brands are compatible with AORUS motherboards. AORUS has verified over 1000+ different modules to ensure performance in an AORUS built system.

X299
AORUS AUDIO
Hi-Fi Audio System as a Built-in Sound Card

Hi-Fi Audio solutions can now be grouped into 2 parts.
The audio signal process is no longer a distorted digital signal, as it now goes through ESS 9218 Sabre DAC for Digital/Analog conversion with 130dB SNR, 112dB THD+N while supporting higher impedance up to 600O headphones. Furthermore, audiophile-grade capacitors and gold-plated audio jacks ensures non-compensated audio performance. Audio Signal Optimization along with the TXC Oscillator provide precise time triggers to Digital-Analog Converters while WIMA capacitors deliver crystal and balanced sound.

Model

Brand
GIGABYTE
Model
X299 AORUS MASTER

Supported CPU

CPU Socket Type
LGA 2066
CPU Type
Support for Intel Core X series 44-lane/28-lane processors (6-core or above) in the LGA2066 package

Chipsets

Chipset
Intel X299

Memory

Number of Memory Slots
8×288pin
Memory Standard
DDR4 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200(O.C.)/ 3000(O.C.)/ 2800(O.C.)/ 2666(O.C.)/ 2400/ 2133
Maximum Memory Supported
128GB
Channel Supported
Quad Channel

Expansion Slots

PCI Express 3.0 x16
2 x PCI Express x16 slots, running at x16 (PCIEX16_1, PCIEX16_2)
2 x PCI Express x16 slots, running at x8 (PCIEX8_1, PCIEX8_2)
(All of the PCI Express slots conform to PCI Express 3.0 standard.)

Storage Devices

SATA 6Gb/s
8 x SATA 6Gb/s
M.2
CPU:
1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe x4/x2 SSD support) (M2M)

Chipset:
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe x4/x2 SSD support) (M2P)
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe x4/x2 SSD support) (M2Q)

* The M2M connector must work with an Intel VROC Upgrade Key to support RAID configuration.
Intel Optane Ready
Yes
SATA RAID
0/1/5/10

Onboard Audio

Audio Chipset
Realtek ALC1220-VB codec
Audio Channels
2/4/5.1/7.1-channel
Support for S/PDIF Out

Onboard LAN

LAN Chipset
Realtek GbE LAN chip
Second LAN Chipset
Intel GbE LAN
Max LAN Speed
10/100/1000/2500Mbps + 10/100/1000Mbps
Wireless LAN
Wi-Fi 802.11 a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band
Support for 11 ac wireless standard and up to 867 Mbps data rate
* Actual data rate may vary depending on environment and equipment.
Bluetooth
BLUETOOTH 4.2, 4.1, BLE, 4.0, 3.0, 2.1+EDR

Rear Panel Ports

RJ45
2 x RJ45
USB 3.1
1 x USB Type-C port, with USB 3.1 Gen 2 support
1 x USB 3.1 Gen 2 Type-A port (red)
6 x USB 3.1 Gen 1 ports
USB Type-C
1 x USB 3.1
S/PDIF Out
1 x Optical
Audio Ports
5 Ports
Antenna Connectors
2 x SMA antenna connectors (2T2R)

Internal I/O Connectors

Onboard USB
1 x USB Type-C header, with USB 3.1 Gen 2 support
2 x USB 3.1 Gen 1 headers
2 x USB 2.0/1.1 headers
Other Connectors
1 x VGA_PW power connector
1 x CPU fan header
1 x water cooling CPU fan header
4 x system fan headers
2 x system fan/water cooling pump headers
2 x addressable LED strip headers
2 x addressable LED strip power select jumpers
2 x RGB LED strip headers
1 x Intel VROC Upgrade Key header
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x Thunderbolt add-in card connector
1 x Trusted Platform Module (TPM) header (2x6-pin, for the GC-TPM2.0_S module only)
1 x reset button
1 x Clear CMOS jumper
2 x temperature sensor headers
2 x BIOS switches

Physical Spec

Form Factor
Extended ATX
LED Lighting
RGB
Dimensions (W x L)
12.0" x 10.6"
Power Pin
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors

Features

Features
Multi-Graphics Technology:
Support for NVIDIA Quad-GPU SLI and 4-Way/3-Way/2-Way NVIDIA SLI technologies
Support for AMD Quad-GPU CrossFire and 4-Way/3-Way/2-Way AMD CrossFire technologies

I/O Controller:
iTE I/O Controller Chip

H/W Monitoring:
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Overheating warning
Fan fail warning
Fan speed control
* Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.

BIOS:
2 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
Support for DualBIOS
Support for Q-Flash Plus
* The USB flash drive used must be a USB 2.0 flash drive.
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Unique Features:
Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
3D OSD
@BIOS
AutoGreen
Cloud Station
EasyTune
Easy RAID
Fast Boot
Game Boost
Platform Power Management
RGB Fusion
Smart Backup
Smart Keyboard
Smart TimeLock
Smart HUD
Smart Survey
System Information Viewer
USB Blocker
USB TurboCharger
Support for Q-Flash
Support for Xpress Install

Bundle Software:
Norton Internet Security (OEM version)
XSplit Gamecaster + Broadcaster (12 months license)

Operating System:
Support for Windows 10 64-bit