HX426C15FBK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4-2666 CL15 288-Pin DIMM
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kingston.com/hyperx
FEATURES
HyperX HX426C15FBK2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-2666 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory
module, based on sixteen 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each
module has been tested to run at DDR4-2666 at a low latency timing
of 15-17-17 at 1.2V. Additional timing parameters are shown in
the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
45ns(min.)
260ns(min.)
26.25ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V
DDR4-2400 CL14-16-16 @1.2V
DDR4-2133 CL12-14-14 @1.2V
•XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink